8th International Conference and Exhibition on Device Packaging - MEMS & Microsystems

2012-03-06 - 2012-03-08
Scottsdale/Fountain Hills, Arizona USA
Presentation and debate of some of the latest and hottest technologies related to MEMS

Conference Details - www.imaps.org/devicepackaging

MEMS & Associated Microsystems Workshop Focus:

The objective of the MEMS & Associated Microsystems Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of MEMS and associated microsystems. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to MEMS technology.

Abstracts are being requested on the following topics:

- MEMS Gyros & Accelerometers - MEMS Sensors & RF Devices - MEMS in Harsh Environments - Microfluidic and Bio-MEMS - MEMS Reliability and Failure Analysis - Optical MEMS (MOEMS) - Integrating MEMS and NEMS - Micromachined Passive Devices - MEMS Packaging and Testing - Innovative Materials and Processing - MEMS Fabrication & Yield Enhancement - Polymer and Laminated MEMS Devices - System Integration of MEMS Devices - Energy Scavenging - Thermal Management Devices - Smart MEMS

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 18, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. Please contact Jackki Morris-Joyner by email at [email protected] or by phone at 305-382-8433 if you have questions.

For more information: http://www.imaps.org/devicepackaging