3-D Architectures for Semiconductor Integration and Packaging Conference

This meeting is firmly established as a leading industry event in 3-D integration and packaging, attracting leaders from around the world as speakers and attendees. The conference format offers a unique opportunity to gain the latest technology and market insights from invited presentations by industry leaders on emerging and on-going 3-D integration and packaging efforts, as well as on topics relating to technology and industry trends impacting this important arena. Substantial opportunities to network with other industry colleagues attending this event are built into the program as well.

The 2012 agenda is now in development. Please check back for updates. Registration is open.

For more information: http://techventure.rti.org/