Design, Test, Integration & Packaging of MEMS / MOEMS2013-04-16 - 2013-04-18
DTIP 2013 will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Seville, Spain in Aix-en-Provence, France in 2011 and in Cannes, Cote d'Azur, France in 2012.
This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
For more information: http://cmp.imag.fr/Conferences/dtip/dtip2013/