Roadmaps for Multi Die Integration: Strategies and Drivers2012-11-14
Santa Clara, CA
Multi die packaging solutions, primarily 2.5D and 3D packaging, are being proposed for applications ranging from cell phones to high performance networking systems. The motives for these approaches vary from cost reduction and form factor miniaturization to power reduction and performance enhancement. A host of alternate approaches to 2.5D and 3D silicon are emerging due to cost and supply chain concerns. The symposium will identify strategies and enabling technologies for Multi Die Integration and explore emerging alternate approaches. A panel session will identify the drivers that require OEMs to consider multi die packaging. A major hurdle to the adoption of multi die Integration Known Good Die (KGD) and multi die testing will be addressed the following day in a symposium at the same location.
For more information: https://meptec.org/meptec2012roadma.html