Device Packaging 2013 - MEMS & Microsystems Workshop

2013-03-12 - 2013-03-14
Radisson Ft McDowell - Fountain Hills, AZ
LAST CALL FOR ABSTRACTS!! Dec 7th due date...

MEMS & Associated Microsystems Workshop Focus: The objective of the MEMS & Associated Microsystems Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of MEMS and Associated Microsystems. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to MEMS technology.

Abstracts are being requested on the following topics:

• MEMS Gyros & Accelerometers
• MEMS Sensors & RF Devices
• MEMS in Harsh Environments
• Microfluidic and Bio-MEMS
• MEMS Reliability and Failure Analysis
• Optical MEMS (MOEMS)
• Integrating MEMS and NEMS
• Micromachined Passive Devices
• MEMS Packaging and Testing
• Innovative Materials and Processing
• MEMS Fabrication & Yield Enhancement
• Polymer and Laminated MEMS Devices
• System Integration of MEMS Devices
• Energy Scavenging
• Thermal Management Devices
• Smart MEMS

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically by November 16, using the on-line submittal form at: www.imaps.org/abstracts.htm.

For more information: http://www.imaps.org/devicepackaging