MEMS and Nanotechnology ClearinghouseMETRIC 2008: Focus on MEMS Packaging2008-05-07 - 2008-05-09Omni William Penn Hotel, Pittsburgh, PA May 7-9, 2008 | Omni William Penn Hotel | Pittsburgh, Pennsylvania, USA Purpose: To identify the critical issues involving MEMS packaging and to develop strategies for addressing them. METRIC 2008, the annual meeting for members of the MEMS Industry Group, will focus on the topic of MEMS Packaging. Packaging is a critical component in the MEMS fabrication process and oftentimes is a major factor in the cost of a device. At METRIC 2008, members-only working groups will discuss what the industry has learned from traditional IC packaging processes and how the MEMS industry applies this know-how to its own unique challenges. We'll also discuss how packaging has been affected by the advent of CMOS and multichip integration; how packaging differs by industry specific applications (consumer electronics, defense applications, telecommunications and medical devices); what is on the horizon for MEMS packaging; and how the industry will harness technology advances to further enhance the commercialization of MEMS. Since METRIC is the annual meeting for MIG members, only members of the MEMS Industry Group may attend! MIG encourages member companies to send two individuals to METRIC who are able to contribute technical experience to the discussions. If you would like more information about joining MIG so that you may attend METRIC, please call Monica Takacs at 412-390-1644 or email mtakacs@memsindustrygroup.org. METRIC 2008 will be held at the Omni William Penn Hotel located in downtown Pittsburgh, Pennsylvania. METRIC begins with an evening reception and panel discussion on May 7 followed by an all day working session on May 8 and a breakfast session on May 9. For more information: http://www.memsindustrygroup.org/i4a/pages/index.cfm?pageid=3417 |