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Topical Worksop on MEMS & Associated Microsystems

Announcement and Call for Abstracts for the Topical Workshop on MEMS & Associated Microsystems

This workshop is being held as a part of the 5th International Conference and Exhibition on Device Packaging.

Those wishing to present in the MEMS & Associated Microsystems Workshop sector of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than September 26, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Abstracts are being requested on the following topics: MEMS Inertial Sensors, MEMS RF Devices, MEMS Sensors (non-inertial), Microfluidic and Bio-MEMS, MEMS Reliability and Failure Analysis, Optical MEMS (MOEMS), Multi-Sensor Integration, MEMS Packaging and Testing, Innovative Materials and Processing, MEMS Operation in Harsh Environments, Polymer and Laminated MEMS Devices, System Integration of MEMS Devices, Energy Scavenging, and Thermal Management Devices.

For more information: http://www.imaps.org/DevicePackaging/mems09.htm