   | IMAPS Device Packaging Conference - Workshop on MEMS and Associated Microsystems2010-03-09 - 2010-03-11Scottsdale/Fountain Hills, Arizona USA The objective of the MEMS & Associated Microsystems Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of MEMS and associated microsystems. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to MEMS technology. Abstracts are being requested on the following topics: -MEMS Inertial Sensors; -MEMS RF Devices; -MEMS Sensors (non-inertial); -Microfluidic and Bio-MEMS; -MEMS Reliability and Failure Analysis; -Optical MEMS (MOEMS); -Multi-Sensor Integration; -MEMS Packaging and Testing; -Innovative Materials and Processing; -MEMS Operation in Harsh Environments; -Polymer and Laminated MEMS Devices; -System Integration of MEMS Devices; -Energy Scavenging; and -Thermal Management Devices. Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 14, 2009. Full conference details at http://www.imaps.org/devicepackaging For more information: http://www.imaps.org/devicepackaging |
MEMS and Nanotechnology Clearinghouse