MEMS Packaging & Reliability Course

2010-08-29
Albuquerque, New Mexico, USA
Semitracks latest one-day MEMS Packaging and Reliability course held concurrently with COMS

Airbag sensors. Digital Light Processing projectors. Inkjet printers. These examples are only a few of the applications for microelectromechanical systems (MEMS), which have quickly become one of the fastest-growing segments in the semiconductor industry. MEMS devices, also referred to as Microsystems Technology (MSTs) or Micromachines, promise to produce smaller, cheaper, more reliable systems--yet can the technology deliver on these promises? Semitracks latest one-day MEMS Packaging and Reliability course, held concurrently with the 2010 Conference on Micro-Nano Systems (COMS) in Albuquerque, NM, focuses on the packaging and reliability of MEMS devices. The large surface area to volume ratio in MEMS devices creates unique challenges--for example, surface effects such as electrostatics and liquid wetting dominate volume effects such as inertia or thermal mass. Yet in spite of these poorly understood properties, MEMS retain the potential to revolutionize the electronics market. The goal of the course is to give you a one-day overview of MEMS technologies by covering packaging, reliability, simulation, and testing. The class focuses on practical application to the situations that you face daily, whether you are a manager, engineer, or technician working in the development, design, simulation, manufacturing, or testing of MEMS products. You'll gain an in-depth knowledge of the challenges and opportunities associated with bringing MEMS and MSTs to market.

For more information: http://www.semitracks.com/index.php/courses/public-courses/mems-packaging-and-reliability