MEMS and Microelectronics Processing Postdoc

For more information: http://www.ee.nd.edu

Overview

Processing of MEMS for IC interconnects and microelectronics packaging. Also, silicon IC processing. If experience in III-V MEMS, then even better.

Requirements

Excellent skills in wafer fab practices, including DRIE, CMP and electroplating.

Responsibilities

Developing new processes in MEMS, assist graduate students and undergrads in their research. Assist in development of publications and proposals.

Application

Send resume and list of two references to Prof. Gary H. Bernstein, [email protected]