Sr. MEMS Packaging Engineer

Overview

The Sr. MEMS Packaging Engineer will work with the MEMS Engineering and Operations Teams to develop packaging requirements for Tunable RF products based on an Integrated MEMS Technology.

Requirements

Education and/or Experience M.S. in Mechanical Engineering, Applied Mechanics, Materials Engineering or Civil Engineering; Ph.D. preferred 5-10 years of electronic packaging experience and preferentially MEMS packaging experience. Wafer level encapsulation of MEMS devices experience is preferred. Experienced Finite Element Analyst should be an expert with non-linear finite element analysis for modeling hygro-thermo-mechanical behavior of packages, modeling shock/drop reliability, and modeling failure modes associated with fracture, delamination, moisture absorption, and large deformations. Specific experience with Abaqus is preferred and experience with CoventorWare is beneficial. Experience with other FEA software and analytical tools such as Matlab will be beneficial. Experienced with package characterization using strain measurement transducers, Moire, Electronic Speckle Interferometry, or white light interferometetry using a Wyko system. Specific experience with Wyko measurement systems will be preferred. Experience with Failure Analysis techniques such as x-sectioning, X-ray microscopy, and Acoustic Microscopy will be beneficial Experienced with the characterization of packaging materials using nano-indentation and DMA, including techniques to evaluate the hermeticity of MEMS encapsulations and characterize the permeability of moisture barriers. Experience with a range of state-of-the-art packaging techniques including but not limited to flip-chip assembly, redistribution layer processes, CSP, WLP, Wafer Level Encapsulation, Underfill and Overmolding techniques. Experience with lead-free material systems. Operating knowledge of JEDEC standards for qualification of packaged products and for packaging standards.

Responsibilities

This position will be responsible for performing finite element analysis of the product at the die-level, package-level, and board-mounted level. To accomplish this task, the engineer will need to have an excellent understanding of state-of-the-art packaging technology, materials, and processes. In addition, the MEMS Packaging Engineer should be familiar with Wafer Level Encapsulation of MEMS devices and successful demonstration of hermeticity. The MEMS Packaging Engineer should be familiar with techniques for characterizing the thermo-mechanical behavior of 0th-, 1st-, and 2nd-level packaging behavior

Application

Please send resume to jobs@wispry.com. No phone calls please. No recruiters please.