MicroElectroMechanical Systems Bonding Engineer III

For more information: http://www.careersathoneywell.com

Overview

This is an exciting time to join Honeywell's Americas Electronic Operations group. This is a great position to showcase your Engineering skills in a highly visible role. We are currently seeking a MicroElectroMechanical Systems Bonding Engineer III - to join our team in Plymouth, MN. Honeywell Aerospace is a $12 billion-plus Strategic Business Group (SBG) with 40,000 employees in over 125 domestic and international locations. We are a leading global aviation supplier designing, manufacturing and distributing advanced mechanical and electronic systems, products and services to commercial, defense and space industries. Honeywell is a diverse company that operates in varied industries and markets. We serve thousands of customers in about 100 countries worldwide, representing numerous cultures.

Requirements

Basic Qualifications: -US Citizenship required due to Government contracts and the ability to obtain a security clearance. -BS or higher degree in engineering, physics or chemistry. -6+ years experience in MicroElectroMechanical Systems/Integrated Circuit wafer fabrication. -3+ years experience in wafer to wafer anodic bonding. Additional Qualifications: -Six sigma, Lean manufacturing certification or Green Belt Certification preferred. -Coursework in IC Design, device physics, product testing or yield enhancement is a plus. -Demonstrated computer and analytical skills in statistical analysis. -Class 100 cleanroom or better in a manufacturing environment. -Excellent communication skills, written and verbal. -Ability to work in team oriented environment with minimum supervision. -Strong problem solving skills. -Demonstrated ability to meet schedules and milestones. -Experience in leading process improvement teams. -Experience in other wafer bonding processes (frit, fusion, and thermal compression, etc) bonding a plus -Knowledge of ISO 9001 requirements and procedures.

Responsibilities

-Provide technical leadership and sustaining for MEMS anodic wafer bonding -Sustaining of wafer processes and equipment. -Trouble-shooting yield and defect issues. -Improving process robustness and capability utilizing Statistical Process Control. -Control of individual process steps as a part of the entire process flow. -Create appropriate and comprehensive process documentation that meets ISO 9001 standards. -Develop and maintain strong internal and external customer relationships. -Assist in planning of complex, high-reliability semiconductor programs. Responsible for development of new process techniques and operations that are robust and transferrable to production status.

Application

At Honeywell, our top priority is having great people who can live up to the demanding expectations of our customers and markets. To help you live up to those expectations, we emphasize continuous learning and development, giving you the chance to develop your career. Apply http://www.careersathoneywell.com, search Job Number 166049. As an Equal Opportunity Employer, Honeywell is committed to a diverse workforce.