Precision machining service provider for hard, brittle materials including glass, quartz, sapphire and advanced technical ceramics. Ultrasonic machining, and complimentary machining capabilities and support services for your customer designs. Single and double side polished borosilicate wafers. Structured borosilicate wafers for MEMS pressure sensor and microfluidic applications. Prototype thru production. Advanced metrology capabilities. ISO 9001-2000.