Mark R. Hornung and Oliver Brand/Hardcover/Published 1999.
Micromachined Ultrasound-Based Proximity Sensors presents
a packaged ultrasound microsystem for object detection and distance
metering based on micromachined silicon transducer elements. It
describes the characterization, optimization and the long-term
stability of silicon membrane resonators as well as appropriate
packaging for ultrasound microsystems.
Micromachined Ultrasound-Based Proximity Sensors describes a
cost-effective approach to the realization of a micro electro
mechanical system (MEMS). The micromachined silicon transducer
elements were fabricated using industrial IC technology combined with
standard silicon micromachining techniques. Additionally, this
approach allows the cointegration of the driving and read-out
circuitry. To ensure the industrial applicability of the fabricated
transducer elements intensive long-term stability and reliability
tests were performed under various environmental conditions such as
high temperature and humidity.
Great effort was undertaken to investigate the packaging and housing
of the ultrasound system, which mainly determine the success or
failure of an industrial microsystem. A low-stress mounting of the
transducer element minimizes thermomechanical stress influences. The
developed housing not only protects the silicon chip but also improves
the acoustic performance of the transducer elements.
The developed ultrasound proximity sensor system can determine object
distances up to 10 cm with an accuracy of better than 0.8 mm.
Micromachined Ultrasound-Based Proximity Sensors will be of
interest to MEMS researchers as well as those involved in solid-state