Advanced Process Systems represents specialized equipment for R&D through production including Meco electro-deposition of photo resist wafer coater
for conformal resist coating on high topography and deep cavities, GnP CMP systems with insitu friction force monitoring system for coupons, 4-6-8 inch wafers. Laurier FC die bonders with (.5um) placement accuracy for MEMS, Meco electroless UBM wafer plater and SRI International's new R&D Fab for MEMS, optoelectronics & 3D advanced packaging.
