|  MEMS and Nanotechnology Clearinghouse- Advanced Process Systems
- Advanced Process Systems represents specialized equipment for R&D through production including Meco electro-deposition of photo resist wafer coater
for conformal resist coating on high topography and deep cavities, GnP CMP systems with insitu friction force monitoring system for coupons, 4-6-8 inch wafers. Laurier FC die bonders with (.5um) placement accuracy for MEMS, Meco electroless UBM wafer plater and SRI International's new R&D Fab for MEMS, optoelectronics & 3D advanced packaging.
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