One of the world's leading providers of wafer-level packaging, Unitive is dedicated to making semiconductors smaller, faster and lighter. With
manufacturing facilities in Research Triangle Park, NC, and Hsinchu, Taiwan,
Unitive partners with customers to meet their specific needs through innovative deployment of technologies, designed to speed time-to-market and lower
costs. Unitive services include multi-level passivation and thin film
wiring, solder bumping and chip scale packaging. Unitive is a subsidiary of Amkor Technology, Inc. one of the world's largest providers of contract
semiconductor assembly and test services.