EnviroEtch (TM) provides a method of continuously etching the top
surface of flat substrates, quickly and efficiently. Designed for
post-diffusion etching of oxide from the surface of solar cells, this
revolutionary system accepts belt-to-belt transfer of wafers eliminating
the need for operator involvement or transfer to carriers. Vapor-phase
etching significantly minimizes acid usage, and contamination from
suspended particulates. This system provides effective, inexpensive,
and rapid removal of oxide from silicon substrates.