|  MEMS and Nanotechnology Clearinghouse- THAT Corporation
- Offers precision silicon wafer grinding and polishing
at its state-of-the-art CMP Center. The Center routinely grinds and
polishes wafers to submicron TTV for THAT's internal use, and is fully
capable of providing the extremely tight tolerances needed for bonded
wafer, dielectric isolation, MEMS, optical devices, and other precision
technologies.
| |
Offers precision silicon wafer grinding and polishing at its state-of-the-art CMP Center. The Center routinely grinds and polishes wafers to submicron TTV for THAT's internal use, and is fully capable of providing the extremely tight tolerances needed for bonded wafer, dielectric isolation, MEMS, optical devices, and other precision technologies.