Hello,

You can contact Furukawa, they make a double sided UV tape (P/N:
UC-228W-110) that might work for you. It is 110µm thick and has an
adhesive strength of 2.5 (N/25mm) before and 0.08 after UV exposure.
Since it the wafer is glass you could expose the tape through the glass
wafer.  I do not know the contact person in your country but you can try
[email protected] and they could guide you to the Furukawa sales person.

If your company needs to cut the wafer into die form, you can contact
Onishi at [email protected]. He is in Europe and can help you with
dicing blades and other precision diamond tools that you may use.

Thank you,

Mario Robles

Tanaka Systems, Inc.
2577 Leghorn Street
Mountain View, CA 94043

650-966-8001 ofc
650-966-1881 fax
www.dicingblades.com


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Jens Tuchscheerer
Sent: Wednesday, April 23, 2003 5:33 AM
To: MemsTalk
Subject: [mems-talk] Looking for double stick tape

Hi
I am looking for a double stick tape to mount a 4 inch Wafer (glass).
But I can't apply high mechanical forces to delaminate the mounting.
so that should be possible by UV-exposure or higher temperature
(max. 60 degree Celcius) or any other principle.

I appreciate your any reply.
Thanks
Jens

_____________________________

Jens Tuchscheerer
Clondiag Chip Technologies GmbH
Loebstedterstr. 105
07749 Jena
Tel.: +49 3641 59470
Fax.: +49 3641 594720
Mail: [email protected]
Web: www.clondiag.com
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