You need better surface preperation and more importantly a better coat
program/sequence to get uniform thickness. It is harder to get uniform thikness
on non-circular plates. For coat sequence you need to first spread the resist
and then high speed dry (thickness control).

Regards,

--- sandhya sandhya  wrote:
> Hai all,
> I am Sandhya,a research student In Boise State University. I have a question
> regarding photolithography, I am getting striations and small bubbles in the
> resist after spinning and i am using SPR 220.7 resist. Can someone please
> kindly say me what might be causing it and what should i do for eliminating
> them.
> Sincerely
> Research student
> Sandhya Reddy
>
>
>
>
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