Hi,
I have used crystalbond509 before.You may want to heat
the wafer assembly on a hot plate to more than 125deg
C (150-160 deg rC) for a few minutes so that
crystalbond will disintegrate.Once the glue
disintegrates you can take it off the plate.You may
again wash the wafer in acetone to remove any small
traces remaining.


--- "K.L.Zheng"  wrote:
> Hello everybody:
>        We used CrystalBondTM509 as the glue between
> quartz and silicon
> during the anisotropic etching of silicon in 75°C
> KOH solution. After
> about 2 hours anisotropic etching, most glue can be
> remove in acetone
> which is protected. But, Some CrystalBond509 ,which
> is exposed to the
> KOH solution, can’t be removed completely.  This
> residues are very
> unwelcoming in the following process.
> Does anyone have experiences about the stripping of
> CrystalBond 509? Any
> suggestion are appreciated.
>
> =======================================
>                      Mr. K.L.Zheng
>
>  Dept. of Precision Machinery and Precision
> Instrumentation
>  University of Science and Technology of China
>
>  Hefei, Anhui Province, 230027,  P.R.China
>
>  E-Mail: [email protected]
> 
>
>  Tel: +86-551-3607405  Fax: +86-551-3607504
> =======================================
>
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe
> or change your list
> options, visit
>
http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS
> processing services.
> Visit us at http://www.memsnet.org/


=====


__________________________________
Do you Yahoo!?
Yahoo! Calendar - Free online calendar with sync to Outlook(TM).
http://calendar.yahoo.com