Hello Shay,

This can be done with a dicing saw and diamond abrasive blades.  You
should get a kerf width of 25µm~35µm depending on the blade you select.
There are many companies that do this service in the US. If you are in
the US please contact me if you would like to know more information on
these companies and the edge quality.

Thank you,

Mario Robles

Tanaka Systems, Inc.
2577 Leghorn Street
Mountain View, CA 94043

650-966-8001 ofc
650-966-1881 fax
www.dicingblades.com
DICING BLADES * BACK GRIND WHEELS * CMP PAD CONDITIONERS


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Shay Kaplan
Sent: Thursday, June 26, 2003 9:23 AM
To: General MEMS discussion
Subject: [mems-talk] laser Machining

Hello,
Does anybody know anyone giving good quality laser machining services?
We need to cut thru 500u silicon with cut width no wider than 30-40u
thanks

shay kaplan


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