Hi Sriram,

If the sputtering is done well, I don't think you need to go through the
degreasing process. maybe you can try and eletroplate Au straight away.

good luck,

AJ Pang



Quoting sriramb :

> Dear All,
>
> I tried to plate Gold over a Platinum thin film (3000 Angstrom) on
> SiO2.
> Before the plating, we go through a degreasing step, wherein we boil
> the
> Silicon wafers in Tri Chloro Ethylene, followed by a dilute HCl dip.
>
> The Pt film is deposited by DC sputtering.
>
> The trouble is that the Pt film peels off when the HCl dip is done.
>
>
> What should I do to overcome this problem?
>
> Thanks in advance.
>
> Thanking You,
> With Best Regards,
> Sriram
> Senior Process Engineer,
> BEL Bangalore
> INDIA
>
>
>
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