Dear All;

I want to make the via holes through pyrex glass wafer.

The desired pitch between each hole is 500 mirons
The desired diameter of each hole is 100 microns.
The thickness of pyrex glass wafer is over 500 microns.

I looked up some books and materials and found that there are three main
fabrication mathod for via holes.

1. Laser drilling
2. Deep RIE etching
3. Wet etching

but I could not found which process is good for the making holes over 500
microns thickness with 100 microns diameter.

If you have good ideas, please tell me how.

Thanks.