Hello,

You should try the next web sites, they may be helpful.

  1.. www.bullen-ultrasonics.com
  2.. http://sensorprepservices.com/index.html
  3.. www.micronit.com

You should try : Vitrotec ,Schott and Corning as well.

Good Luck,

Danny Klein.
-----------------------------------------------------

Danny Klein
Faculty of Mechanical Engineering
Technion, Israel Institute of Technology
Haifa, 32000
Israel

Tel (Lab.): 972-4-8292946(3861)
Email: [email protected]

-----------------------------------------------------


  ----- Original Message -----
  From: choe
  To: General MEMS discussion
  Sent: Friday, August 08, 2003 1:53 PM
  Subject: [mems-talk] How to fabricate Via holes through pyrex glass


  Dear All;

  I want to make the via holes through pyrex glass wafer.

  The desired pitch between each hole is 500 mirons
  The desired diameter of each hole is 100 microns.
  The thickness of pyrex glass wafer is over 500 microns.

  I looked up some books and materials and found that there are three main
  fabrication mathod for via holes.

  1. Laser drilling
  2. Deep RIE etching
  3. Wet etching

  but I could not found which process is good for the making holes over 500
  microns thickness with 100 microns diameter.

  If you have good ideas, please tell me how.

  Thanks.


  _______________________________________________
  [email protected] mailing list: to unsubscribe or change your list
  options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
  Hosted by the MEMS Exchange, providers of MEMS processing services.
  Visit us at http://www.memsnet.org/