Joel,

I doubt that you can remove a chip that has already been properly anodic
bonded.  The anodic forces are very strong and handling without breaking
is difficult.

Our company manufacturers silicon die, either constrained to Pyrex or
not(bare).  You can get the Pyrex with a hole in it for providing an
atmospheric  reference (gauge).  You can also get it constrained to one
without a hole and sealed in a vacuum (absolute) or constrained to one
without a hole and sealed at current atmospheric pressure(static).  The
static seal is usually used at very high pressure only.

It might be advisable to get the one with a constraint(and hole) to aid in
your mounting.  Bare die mounting stresses can be wicked, especially in
very low pressure ranges.


Regards,

Rich Rosenblum
Principal Electrical Engineer
Ametek PMT
[email protected]
Tel:  215-354-1826






Does anybody has the experience on how to separate a pressure silicon chip
from the pyrex support glas. I have a chip that is mounted by anodic
bonding on the pyrex but need to remove it in order to use the pressor
sensor in gauge conditions.

Thanks for any comments on that.

Joel

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