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MEMSnet Home: MEMS-Talk: low temperature anodic bonding
low temperature anodic bonding
2003-10-21
ERIC SIMONE
2003-10-23
taya sunil
PMMA as microcantilever material
2003-10-23
Samir Kagadkar
2003-10-21
Tomblin, Graham (OH32)
low temperature anodic bonding
taya sunil
2003-10-23
i have bonded pyrex to silicon at temperatures as low
as 270 C at high applied DC ~1.5kV. it takes nearly 30
minutes to bond 20mm X 20 mm. i do not know what type
of glass u r using but may be u could find it helpful.

sunil k taya

 --- ERIC SIMONE  wrote: > I was
wondering if anyone has a good recipe for low
> temperature anodic bonding, where by low I mean no
> higher than 200 or 250C. I'm trying to bond a
> microscope cover glass to a Si wafer but do not want
> to heat up too high, since the thermal coefficient
> is different for this glass, compared to the Si
> (thus when they cool there will be cracking) Thanks
> much.
>
>
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