I always get some undercut when etching grooves on (100) Si wafer using
KOH+Isopropyl alcohol. I use PECVD nitrate mask. Is that a regular result? Is
there any analytic equation for this undercut? Can it be estimated?
Comments and/or references are appreciated.
Thanks.
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Isa Kiyat

Bilkent University
Department of Physics
06800
Ankara, Turkey