Hi!

I am designing a structure for a microfluidic application, and i am thinking
about the possibility of bonding (anodic bonding) a pyrex glass with a silicon
structure.

I would need to open a through-wafer via in pyrex (20 um diameter), and i would
like to know if this is possible. I have read in a message that maybe
photosensitive glass would be more suitable for this.

I would like to know if any machinig (in fact, opening the via) can be done
after bonding, without any damage to de device.

Thanks everybody, Eva.