Hi, I need thick Ni layer as etching mask, as thick Ni has stress problem,
so I tried to make Ti(200A)/Ni(1000A)/Ti(200A)/Ni(1000A) metal
layers for liftoff,(ebeam depostion, Ti rate is 6A/s, Ni rate is 6A/s).
Metal surface is not good, there is large dots topography, not smooth. Is this
related to stress? Is my deposition rate too high? Will lower rate
results in smaller stress?