Would photoresist be an option? Three or 4 small drops of PR would be enough
to stick the devive wafer to the carrier. PR is compatible with DRIE, and
removable by Azeton. As a disadvantage, temperature control of the device
wafer during DRIE may be an issue.

Best regards

Burkhard
-----Ursprüngliche Nachricht-----
Von: Rahul Agarwal 
An: [email protected] 
Datum: Mittwoch, 7. April 2004 19:03
Betreff: [mems-talk] Temporary Bonding for DRIE


>To do the DRIE I have to bond the wafer from the back
>side otherwise the devices will just fall off, which I can't afford.
>So I am looking for some material which I can use to temporary bond the
>device wafer to a handle wafer, do the DRIE and then take the handle
>wafer off, after I have done the final bonding of my devices from the
>top side (after DRIE).