Hi Rahual,
The limiting factor to this process will be process temp.  Most people use wax
or adhesive for a temporary bond.  The mounting wafer will have through holes so
the bonded pair can be placed in solvent or acetone to separate the two wafers.
The most common waxes and adhesives are limited to around 300 C.  I have seen
some go as high as 500 C but these are proprietary mixtures and I do not have
any info on them.  You can use resist as long as the wafers will not be subject
to temps higher than the cross linking temp of the resist.  You can expect to
soak the wafers over night to release them.

Please contact me if you have any questions,
Brad

Brad Johnson
Suss MicroTec
Applications Engineer
Phoenix 1-480-557-9370 Ext119
Vermont 1-800-685-7877 Ext305
[email protected]


>>> [email protected] 04/07/04 12:31PM >>>
Hi all,
I have to do DRIE to separate some of my devices which are built in the
bulk of silicon. To do the DRIE I have to bond the wafer from the back
side otherwise the devices will just fall off, which I can't afford.
So I am looking for some material which I can use to temporary bond the
device wafer to a handle wafer, do the DRIE and then take the handle
wafer off, after I have done the final bonding of my devices from the
top side (after DRIE). So my process will be like: 1. Pre processing in
bulk of silicon (side 1). 2. Temporary Bond the processed wafer to
handle wafer (from side 2). 3. Through wafer DRIE (side 1). 4. Final
bonding of the wafer, eutectic bonding or something like that (side 1).
5. Take off the temporary bonded handle wafer (side 2).

I will highly appreciate any advice/direction in this matter. Thanks
 Rahul Agarwal