Assuming your substrate is silicon, you might double check that you are
fully developing the resist. You may have a little bit left at the
bottom of your features. You might also try a descum step in an oxygen
plasma.

Good luck,
   Mike


>>> [email protected] 4/13/2004 3:24:33 PM >>>
Hi members:
I tried to do a lift-off process. after deposition 300nm Cr, I always
found micro-cracks
around the edge and corners. what is the
reason for such microcracks? the intrinsic stress? How to avoid it?
thanks.

Regards,
Yilei Zhang






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