Hi,

I would recommend "Semiconductor Wafer Bonding, Science and Technology" from
Tong and Goesele. ISBN 0-471-57481-3

"After a 15sec. HF dip in 1%, the Si surface is highly hydrophobic with a
contact angle of  ~70deg."

Regards,

Reiner

<[ -----Original Message-----
<[ From: Gaelle POUGET [mailto:[email protected]]
<[ Sent: Thursday, April 22, 2004 8:31 AM
<[ To: [email protected]
<[ Subject: [mems-talk] interface with Si
<[
<[
<[ Does anyone know the contact angle between water and silicon
<[ (HF cleaned
<[ substrate) or silica? Or maybe recommend a good link?
<[
<[
<[ Does anyone work on the interface between microelectronic
<[ wafers and water
<[ (or wafers with alcohol IPA or alkane)
<[
<[ Thanks
<[
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