Dear all,

could anyone help me please.
I am doing some electroplating using SU-8 mould.
gold is evaporated before SU-8 is deposited.
after the developing step,
many SU-8 parts fall off of the wafer with gold film attached to them,
how do i improve the adhesion between Si and the gold film,
so that i have a a complete patterned wafer??

thanks for the help.

Chen han

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Chen-Han Lee
Research Student
School of Manufacturing and Mechanical Engineering,
University of Birmingham,
Birmingham, B15 2TT
United Kingdom,
Phone :  +44 121 4144245
Fax :    +44 121 4143958
E-Mail : [email protected]
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