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MEMSnet Home: MEMS-Talk: SU8 exposure time
SU8 exposure time
2004-12-08
laetitia philippe
2004-12-10
Christoph Friese
2004-12-09
Brubaker Chad
2004-12-11
Michael L
2004-12-13
Brubaker Chad
SU8 exposure time
Brubaker Chad
2004-12-09
Carson,

You have to remember that SU-8 is a negative tone material - basically, where
you expose, the material will remain.

As such, this means that, the higher your exposure gets, the wider your
remaining linewidths will become. In the case of a massive overexposure (such as
your 100second, or 2 J/cm2), this can actually prevent narrow trench features
from developing out.

An optimal dose for the thickness you are exposing is ~300 mJ/cm2 (or, about 15
seconds).  Unfortunately, the nature of the SU-8 will mean that some residual
stress will exist in the film, but with care taken during the baking steps, this
stress can be minimized.

One final comment (one I have made before) - be very careful that you are not
allowing the SU-8 to experience UV wavelengths below 350nm - this can cause
extremely unpredictable results during exposure.

Best Regards,
Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel:  480.727.9635, Fax:  480.727.9700  e-mail:
[email protected], www.EVGroup.com

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 -----Original Message-----
From:   [email protected] [mailto:[email protected]]  On
Behalf Of laetitia philippe
Sent:   Wednesday, December 08, 2004 9:02 AM
To:     [email protected]
Subject:        [mems-talk] SU8 exposure time

Hello All,



I am trying to find the best exposure time for a SU8-2035 with a

thickness of around 50 um

This is not looking to be very easy. I am working with a UV i-line 365

nm, with 20 mW/cm2



For high exposure time (up to 100s ), I see that my structure does not

developp at all, i.e. the exposed polymer is not removed in the

developper although the sutructre is clearly visible with a color difference

between the exposed and non exposed part



For reasonnable exposure time (20 s), I have a good developpment but I

have always a resulting mould that is small as my mask. i.e some

feature of my pattern of 200 um would lead to only 100 um cavity in my

developped polymer and so one.



Finally, when I go down to 7 seconds, I have a good resulting mould,

with much better dimensions, but I have enormous stress on my polymer and

sometimes delamination which makes me thing I am under exposing of

course





Could someone share his own experience about that? especially about the

over-exposure'?



Many thanks

Carson



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