Adhesion problem with electroplated metal layers (Au or Ag)


Hello all,

We experience problems with the electroplating of Au (thickness of about 5
microns) on oxidized Si-wafers (100) with structured Cr/Au seed layer (10
nm and 30 nm, resp.). The front surface features an 8x16 array of
edge-connected squares of 10 mm2 area. The back side is coated with Cr
only. So far, the produced metallic structure easily flakes off from the
SiO2 substrate during or after the electroplating process (ORIMA B,
Schlötter GmbH, PH 4.2). Separated flakes and the edges of surviving metal
patches bends outwards. Furthermore, the layered metal foil is quite
brittle. Tests with Ag instead of Au showed similar problems.

Could someone tell me what probably went wrong and how we can fix these
problems?

Regards

Michael Kobusch


[email protected]