Dear MEMS-talk suscribers,

Pulse-plating method is currently used nowadays for making deposition. I would
like to have some ideas of what is exactly changing with pulse-plating and how
it changes the quality of the deposition? (onis it only in terms of current
density uniformity?)

Although is someone aware of people comparing mechanical properties of deposits
made with and without pulse-plating? i.e does the Pulse plating methods change
the microstructure of the deposit?

Many thanks

Adrienne from Porto



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