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MEMSnet Home: MEMS-Talk: RE: Bonding of SU-8 to SU-8
RE: Bonding of SU-8 to SU-8
2005-01-12
Zoberbier, Margarete
2005-01-12
Shile
RE: Bonding of SU-8 to SU-8
Zoberbier, Margarete
2005-01-12
Hello Thorsten,

typically the parameters for SU8 to SU8 bonding are as follows:T=100°C,
F=1000N (process under vacuum). A good bond result can be also achieved by
using different temperature steps in the bonding process. Also the
pretreatment of the SU8 - prebake, exposure, post exposure and relaxation
time - are very important steps to get a good bond result of SU8. An uniform
pressure and heat is neccessary to achieve a good bond result, of course.

I did already a lot of SU8 bondings with good success and I would like to
share my knowledge with. Due to the size of the files I am going to send it
directly to you.

Best Regards,
Margarete Zoberbier

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