Hi again,

What about buying TaN material (rather than Ta) and then evaporate it
straight without presence of any nitrogen in the chamber?? Would that be
a solution or it is not recommended??

I  need it under the TiW/Au layers over alumina substrate (it is almost
standard for Microwave Integrate Circuits MIC)  and I heard people would
do all three layers deposition and then start etching from the top Au
film. So you think it would be a difficult job to do and just use
regular resist to pattern the TaN???

Thanks a lot for all the replies.
Mojgan