Dear colleagues,

I want to make a number of Ni islands(each has thickness of 200um and 300um x
300um size,and 200um spaced between each other) electroformed through UV cured
SU-8 100 mold(also 200um thickness after lapping) using sputtering Cr/Cu as seed
layer on glass substrate.Has anyone used OmniCoat(from MicroChem) thin film for
helping hot remover PG(from MicroChem) to remove cured SU-8 mold without
ablation of the Ni islands? Is the OmniCoat helpful? And what process conditions
should be noticed?
 Or please propose what other effective way of removing SU-8 mold after
electroforming.

Thanks for your time and assistance.
Best Regards.

Feng Cui,
Research Institiute of Micro/Nanometer science & technology
Shanghai Jiao Tong University,P.R China