Dear group members
Has anybody experience with dielectric passivation. I would like to
cover homogeneously two metal interconnects with a dielectric layer in
order to isolate them from the surrounding humid environment. These
interconnects will be used in MCM's for through holes applications.
The interconnects are 5mum high, and  PECVD-oxide doesn't offer a good
stepcoverage. I have tried evaporated glass without good results.
This dielectric layer has to be patterned in order to open contact holes
to the metallines. So materials like Parylene (a polymer)is out of
question (difficult to etch).
Does anybody have a ready-to-use solution?

                            regards.Mounir.

Mikroelektronik Centret, building 345, room 154
Technical University of Denmark, DK-2800 Lyngby.