Hi, Colleagues,
We are setting up a electroplating tank for Cu plating. It would be
convenient if Cu could be directly electroplated onto aluminum. But
very few literatures were talking about this. What are the problems in
doing so, the seed layer, migration or other reliability concerns?
It will be appreciated if somebody can share their experiences on this with us.

Regards,

Hongwei Qu

Research Assistant,
Dept. of Electrical and Computer Eng.
University of Florida