I want to have a ion source to ion mill photoresist and the substrate(glass
or silicon).

1. When the beam hits the surface work piece, the beam diameter will be
3-5mm.
2. The ion is Ar+. The energy of the ion is about 500ev. or higher
3. When the beam hits the surface it is better to be neutralized in
electricity. However, it can be optional.
4. The current is 0.2-5mA.
5. I am etching away photoresist and glass substrate and silicon wafer.
6. Max depth will be 1um. But that is just the maximum.

I called some vendors and they only have wide beam Kaufmann source. I wonder
if anyone had any experience in narrow beam ion source for milling purposes?

thanks
Andrew