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MEMSnet Home: MEMS-Talk: PECVD PolySi Deposition
Bosch process
2005-03-09
Pavel Neuzil
2005-03-10
Kasman , Elina
2005-03-10
Michael D Martin
PECVD PolySi Deposition
2005-03-11
Eric Dy
High fequency amplification
2005-03-11
Vikas Nair
2005-03-11
Isaac Wing Tak Chan
Microscopy for Semiconductor Application
2005-03-13
li cai
2005-03-12
li cai
etch sub-micron holes in PMMA patterned Aluminum
2005-03-12
Xin Heng
PECVD PolySi Deposition
Isaac Wing Tak Chan
2005-03-11
Hi Eric,

You cannot directly deposit poly-Si by PECVD. Direct deposition using this
technique can get microcrystalline silicon (uc-Si:H) with SiH4 and H2
dilution. Without H2 dilution, it is amorphous silicon (a-Si:H). For
indirect method, after a-Si:H dep., you can use eximer laser annealing
(ELA) to recrystallize the film. Or, you can use post-dep (with or without
metal-induced) thermal annealing methods. If you want direct deposition of
poly-Si, you use thermal CVD methods, like LPCVD.

Yours sincerely,

Isaac Chan, Ph.D.
University of Waterloo

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