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MEMSnet Home: MEMS-Talk: Cracks in glass wafer during anodic bonding
Cracks in glass wafer during anodic bonding
2005-03-23
Andreas Jahn
2005-03-23
Shane Arthur McColman
2005-03-24
[email protected]
2005-03-24
Kirt Williams
2005-03-23
[email protected]
2005-03-24
BRAD JOHNSON
Cracks in glass wafer during anodic bonding
Kirt Williams
2005-03-24
Just to confirm: are you using Pyrex 7740 or a similar TCE-matched glass?
Other Pyrex glasses will crack due to shrinking more or less than the
silicon during cooling.
    --Kirt Williams

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