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MEMSnet Home: MEMS-Talk: Re: RE: [mems-talk] Cracks in glass wafer during anodic bonding
Re: RE: [mems-talk] Cracks in glass wafer during anodic bonding
2005-03-24
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diff between DC plasma and RF plasma?
2005-03-24
Andrew Xiang
Re: RE: [mems-talk] Cracks in glass wafer during anodic bonding
[email protected]
2005-03-24
Try to preheat the sample, slow up and slow down. Glass cracks because the
strain energy is high, a little heat will relax the strain.  Ideal temperature
is around the tg of the glass...

Rob

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