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MEMSnet Home: MEMS-Talk: Adhesion problem
Adhesion problem
2005-04-11
ahajjiah
2005-04-14
Andrew Xiang
2005-04-11
William Lanford-Crick
2005-04-14
ahajjiah
2005-04-15
Shile
Adhesion problem
William Lanford-Crick
2005-04-11
Hi,
Use thinner Ni (if possible) and/or slower deposition rate.
Ni has a lot of internal stress, and often doesn't still well
to GaN.  For your reference, we deposit up to 1000A Ni on GaN
at about 3-5 A/sec and do not have any problems.

Bill

>I am using e-beam to deposit Ni(1.5kA) on GaN. My Chamber
pressure is below
>1e-6 and my deposition rate is below 10A/s. I have done the
tape test on the
>sample and found out that my metal is not sticking very well
to the sample.

reply
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