> Is it true that TiW and Au film stack is a better choice than CrAu when it
> comes to sputtering seed layers on ceramic substrate?  Also can anyone
> give me a suggestion on what % of W I should use for the TiW target If I
> were to use it as an adhesion layer between ceramic and Au.

TiW has several practical advantages over Cr, some of them only relevant to
the semiconductor industry. It combines good adhesion with diffusion
barrier properties. It's stress can be easily controlled by the deposition
pressure.
Typical Ti content in the target (there will be less in your film) is 7 to
15 weight%, 10% being the most common.

best regards
Klaus Beschorner
Metron Technology, European Applications Manager
Drosselweg 6,71120 Grafenau,Germany. Tel +49-7033-45683