A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Si-Si Bonding
Si-Si Bonding
2005-04-12
[email protected]
DC or AC plasma
2005-04-12
Andrew Xiang
2005-04-12
Bill Moffat
2005-04-12
Bill Moffat
Si-Si Bonding
Bill Moffat
2005-04-12
5 minutes of plasma power in a capacitive plasma generator.  About 1
watt per square inch Oxygen plasma.  Then press the 2 active faces
together.  Trick is uniform plama from capacitive generator.  The plasma
breaks the surface bonds.  It takes days even weeks for the surface
bonds to realign.  If you press the wafers together the surface bonds
from each wafer, bond to the other wafers disturbed bonds.  Contact me
for more information or free tests.  Bill Moffat


reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
MEMStaff Inc.
Mentor Graphics Corporation
Nano-Master, Inc.
Harrick Plasma, Inc.